Koch-Chemie's Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's Micro Cut M3.02 and/or Micro Cut & Finish P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety..
COMPRESSION HARDNESS: 10
ABRASIVENESS: 5
Notice
This product information can advise you only without obligation. Liability on the part of Koch-Chemie cannot be derived. Please check whether the product is suitable for your application.
- Rated 5 out of 5 stars3 years agoPrefect pad
Does everything you want in a pad and can also cut & finish
Quickly and efficiently. My clients have friends ask what do
they do to there automobile.
RBRobert B. - Rated 5 out of 5 stars3 years agoAmazing Pads
Pads provide great finishing capability paired with its polish counterpart
CGColby G. - Rated 5 out of 5 stars3 years agoGreat product, excellent company
Items came quickly, packaged well, no damage
ZKZechariah K.