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Micro Cut Pad

Regular price $10.99

Size
Quantity
5.0
Rated 5.0 out of 5 stars
3 Reviews

Koch-Chemie's Micro Cut PadΒ is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's Micro CutΒ M3.02 and/or Micro Cut & FinishΒ P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colorful non-woven material, suitable for polishing, ensures process safety..

COMPRESSION HARDNESS: 10

ABRASIVENESS: 5

Notice

This product information can advise you only without obligation. Liability on the part of Koch-Chemie cannot be derived. Please check whether the product is suitable for your application.

5.0
Rated 5.0 out of 5 stars
Based on 3 reviews
Total 5 star reviews: 3 Total 4 star reviews: 0 Total 3 star reviews: 0 Total 2 star reviews: 0 Total 1 star reviews: 0
100%would recommend this product
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3 reviews
  • Rated 5 out of 5 stars
    3 years ago
    Prefect pad

    Does everything you want in a pad and can also cut & finish

    Quickly and efficiently. My clients have friends ask what do

    they do to there automobile.

    RB
    Robert B.
  • Rated 5 out of 5 stars
    3 years ago
    Amazing Pads

    Pads provide great finishing capability paired with its polish counterpart

    CG
    Colby G.
  • Rated 5 out of 5 stars
    3 years ago
    Great product, excellent company

    Items came quickly, packaged well, no damage

    ZK
    Zechariah K.
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